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MILPITAS, Calif. — April 29, 2008 — Oxford Semiconductor, a semiconductor company
specialized in systems interconnectivity, today announced its first PCI Express (PCIe)
serial connectivity device design win, placed by Axxon Computer Corporation. The
volume order is for Oxford’s OXPCIe952, part of the company’s Expresso family of
high-performance PCIe compliant products that began sampling in the fourth quarter
of 2007.
Supporting dual serial and parallel port interfaces, the OXPCIe952 is ideal for a diverse
range of applications requiring low density port expansion including PC add-on cards,
industrial PC, point of sale terminals, industrial control, building automation, network
management and embedded systems. The OXPCIe952 incorporates Oxford’s high
performance 950 UART technology with advanced MSI-X interrupt handling and bus
master DMA, to bring high system performance and flexibility.
“Oxford is not only first to market with a product that meets our spec requirements,
they have surpassed our expectations by delivering a part that is incredibly easy to
design in and presents us with a significant time-to-market benefit,” said Kumar
Bhatia, CTO at Axxon Computer Corp. “At the semiconductor level, it is a very high-
performance device with the type of functionality, speed and power management that
puts Oxford right at the forefront of the market. Add to that the software device
drivers that Oxford has developed, and you have the optimal solution on the market
today.”
The OXPCIe952 is part of Oxford Semiconductor’s Expresso family of PCI Express to
Multi-Port Serial and Parallel Port expansion devices delivering high performance,
reliable, industrial-grade PCI Express-based connectivity expansion solutions to
interconnect system processors with multiple serial peripherals.
Driven by the transition in processor-based systems and associated chipsets from PCI
to PCI Express as the main peripheral bus, the Expresso family of OXPCIe952,
OXPCIe954, OXPCIe958 and OXPCIe840 targets the PC peripheral, industrial control,
point of sale, server, communications and embedded systems markets with two, four
and eight serial port options plus a standalone parallel port device.
The new devices offer considerable performance, time-to-market and system cost
enhancements over competing solutions, including PCI SIG certified PCI Express
compliance, WHQL certified device drivers, a CPU overhead savings of up to 70
percent for eight ports at 1Mbps, easy device customization with the company’s Oxide
customization tool and 30 percent – 40 percent BOM savings.
“This design win represents yet another milestone for our Expresso family of PCIe
compliant devices,” stated Adrian Braine, marketing director for connectivity solutions
at Oxford Semiconductor. “In October, we shipped and announced first to market end-
point silicon. We believe this order represents another first in actual customer
implementation, and is a further demonstration of our leadership in this market.”
Oxford Semiconductor’s Oxide Customization software comes as standard with all of
its serial connectivity solutions, and is designed to accelerate product development
and time to market of the company’s high performance solutions. It features an
intuitive graphical user interface that enables simple ‘point and click’ feature
selection and text box entry for fast, error free customization without resorting to
source code editing. In short, it removes more complex, time consuming, error prone
manual editing of programming files and driver source code.
The proprietary software includes tools for developing EEPROM programming and .INF
files, as well as tools for customizing the Device Properties page of the Device
Manager. Leveraging the power of these tools, engineers can make complex changes to
device and driver set-up in minutes, and with minimal knowledge of the underlying
software.
Once customization is complete, the EEPROM can be programmed in-circuit through
the Oxide’s EEPROM interface, or it can be dumped to a programming file and the
customized device driver package is then ready to install.
About Oxford Semiconductor
Whether transferring data from a consumer product to a storage device, backing-up
and protecting data, or delivering a command from a host device to a peripheral,
Oxford Semiconductor is at the very heart of data and content access, distribution and
delivery. Established in 1992, the company provides a broad range of semiconductor
hardware and software solutions that enable seamless device-to-device
interconnectivity. Headquartered in Milpitas, California, the company has a design
center in Abingdon, UK and sales support offices worldwide. For more information visit
http://www.oxsemi.com.
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