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飞思卡尔(Freescale)公司的MC13224是第三代 ZigBee封装内平台( PiP),集成了完整的低功耗2.4GHz无线电收发器,基于32位ARM7核的MCU,用于IEEE 802.15.4 MAC 和AES安全加密的硬件加速器以及MCU成套外设,是高密度低元件数的IEEE 802.15.4综合解决方案,能实现点对点连接和完整的ZigBee网状网络,因此可广泛应用在住宅区和商业自动化,工业控制,HVAC, 卫生保健和消费类电子等产品.本文介绍采用MC1322x的1322x传感器节点的主要特性,详细的电路图以及所用的元器件清单(BOM).
MC13224V Advanced ZigBee™- Compliant Platform-in-Package (PiP) for the 2.4 GHz IEEE® 802.15.4 Standard The MC13224V is Freescale’s third-generation ZigBee platform which incorporate a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7 core based MCU, hardware acceleration for both the IEEE 802.15.4 MAC and AES security, and a full set of MCU peripherals into a 99-pin LGA Platform-in-Package (PiP). The MC13224V solution can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC13224V is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The MC13224V MCU resources offer superior processing power for ZigBee applications. A full 32-bit ARM7TDMI-S core operates up to 26 MHz. A 128 Kbyte FLASH memory is mirrored into a 96 Kbyte RAM for upper stack and applications software. In addition, an 80 Kbyte ROM is available for boot software, standardized IEEE 802.15.4 MAC and communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data complement the processor core. Freescale has created the most complete set of hardware platforms for evaluating the MC1322x Platform in Package™ (PiP), allowing the developer to select the hardware and software platform that best meets their needs. The development boards include LEDs, push buttons, connectors, header pins and a programming/debug port. The boards can be powered by batteries, a DC adapter or the USB port. The JTAG port allows easy programming of the MC1322x flash memory via the J-link JTAG debugger, which enables the users to program the MCU with a variety of sample applications included with the BeeKit software. The MC1322x development kits are the ideal platform for more complex IEEE® 802.15.4 and ZigBee applications by providing plenty of memory and expansion capabilities. Unique to the MC1322x is the capability the boost speed 8x over IEEE® 802.15.4 data rates. This capability is better suited for applications such as voice, wireless headsets, and compressed audio. The development board features a headset jack for demonstration and development of these applications. The unique PiP design integrates the 2.4 GHz transceiver, ARM7TDMI, memory, I/O and RF matching components into a single package, significantly reducing the component cost and solution size. The MC1322x development kits are the ideal platforms for more complex 802.15.4 and ZigBee applications, providing plenty of memory and expansion capabilities. 1322x-SRB (Sensor Reference Board) The 1322x-SRB contains an MC13224 PiP, an MMA7260Q three-axis acceleration sensor, MPXV5010G pressure sensor and a temperature sensor. The SRB provides a complete platform for evaluating the MC13224 PiP. 1322x-NCB (Network Coordinator Board) The 1322x-NCB contains the MC13224 IC and a graphic LCD, creating the ideal demonstration platform for network coordinators. The LCD enables network monitoring by providing status messages. 1322x-LPB (Low Power Board) The 1322x-LPB contains the MC13224 and is ideal for power measurements. The small form factor supports both AAA batteries and coin cell use and has the optional buck converter enabled to provide a low power option. 1322x-USB The 1322x-USB is programmed to function as an 802.15.4/ZigBee packet sniffer and can be used with the Daintree Sensor Network Analyzer software. The device can also be reprogrammed to support customer applications, providing a small form factor device for PC connectivity.
1322x Sensor Node The 1322x Sensor Node is an IEEE 802.15.4 compliant evaluation board based on the Freescale MC1322X device. The heart of the 1322x Sensor Node is Freescale’s MC1322x 99-pin LGA Platform-in-Package (PiP) solution that can be used for wireless applications ranging from simple proprietary point-to-point connectivity to complete ZigBee mesh networking. The MC1322x is designed to provide a highly integrated, total solution, with premier processing capabilities and very low power consumption. The 1322x Sensor Node provides a platform to evaluate the MC1322x device, develop software and applications, and demonstrate IEEE 802.15.4 and ZigBee networking capabilities. The Sensor Node surrounds the core device with capabilities that provide a complete 802.15.4 radio, user interface, debugging capabilities, connection to personal computers (PCs) and other devices, sensors, and portability.

图1.1322x传感器节点板外形图 1322x传感器节点主要特性: The 1322x Sensor Node provides the following features: Full IEEE 802.15.4 compliant wireless node; ZigBee capable with Freescale’s BeeStack software stack
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